Temperature is an important factor affecting the performance of high-voltage self-healing capacitor. Consequently

the temperature field distribution of high-voltage self-healing capacitor at typical operating conditions in power systems are simulated and experimentally studied. At the same time

some suggestions for its architecture optimization are given. On the basis of reasonable simplification and basic assumption

a 3D temperature field model of high-voltage self-healing capacitor is formulated based on finite element method-Ansys. To validate the models

two types of high-voltage self-healing capacitors are designed and manufactured. The heat stability tests about the two capacitors are c

onducted in thermostat. The internal and surface temperatures of the capacitors are measured and the results validate the formulated model. By comparing the measured values of the temperature rise of the capacitors with the simulated values through 3 kinds of test conditions

the error is less than 1 ℃. Based on theoretical analysis and numerical calculations

some important aspects in the process of design of high-voltage self-healing capacitor are given

and choosing the wider and thicker polypropylene film can be helpful for reducing the total loss. The arrangement of capacitor components and diameter of capacitor component have little effect on the loss

thus can be selected according to the easier way out. On the basis of the above investigations

the optimal design about a high-voltage self-healing capacitor with a nominal voltage of 11/3

1/2

k V and a capacity of 334 k VA is presented an reinspected with the different simulation tool COMSOL. The emulation results of the two simulation software under the same conditions are within 1 ℃.