Simulation Calculation of Temperature Field Distribution in High Voltage Cable Joints
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Simulation Calculation of Temperature Field Distribution in High Voltage Cable Joints
Vol. 44, Issue 11, Pages: 3688-3698(2018)
作者机构:
1. 华南理工大学电力学院
2. 广东电机工程学会电缆专委会
作者简介:
基金信息:
DOI:
CLC:
Published Online:22 November 2018,
Published:2018
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LIU Gang, WANG Pengyu, MAO Jiankun, et al. Simulation Calculation of Temperature Field Distribution in High Voltage Cable Joints[J]. 2018, 44(11): 3688-3698.
DOI:
LIU Gang, WANG Pengyu, MAO Jiankun, et al. Simulation Calculation of Temperature Field Distribution in High Voltage Cable Joints[J]. 2018, 44(11): 3688-3698.DOI:
Simulation Calculation of Temperature Field Distribution in High Voltage Cable Joints
Temperature is a direct factor limiting the current carrying capacity of cable joints
thus studying the temperature field distribution of cable joints was critical to achieving an accurate assessment of the current carrying capacity of cable joints. We established a two-dimensional axial simulation model of joints and analyzed the temperature field of joints under different loads. Then
we designed the steady-state temperature rise experiments of cable joints
and measured the steady temperature distribution of joints under different loads. Finally
we adopted the two-dimensional axial joint simulation model to study the influences of the ambient temperature
the convective heat transfer coefficient
the main pieces of insulation
and protective shell filled with plastic thermal conductivity changes on the steady-state temperature distribution in the joints
and then put forward a full range of cable ampacity promotion strategies. The comparisons between the experimental results and the simulation results show that the absolute errors of the conductor temperature calculated by the two-dimensional axial simulation model of joints under different loads are less than 10%. Thus
adopting the two-dimensional axial simulation model of joints to calculate the temperature field distribution of cable joint can meet the requirements of engineering application.