Internal Curing Reaction and Numerical Analysis of Temperature Field of Cycloaliphatic Epoxy Resin Insulators
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Internal Curing Reaction and Numerical Analysis of Temperature Field of Cycloaliphatic Epoxy Resin Insulators
Vol. 46, Issue 6, Pages: 1986-1993(2020)
作者机构:
1. 清华大学深圳国际研究生院
2. 清华大学电机工程与应用电子技术系
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Published Online:30 June 2020,
Published:2020
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LIU Yuhao, LIN Ying, WANG Liming, et al. Internal Curing Reaction and Numerical Analysis of Temperature Field of Cycloaliphatic Epoxy Resin Insulators[J]. 2020, 46(6): 1986-1993.
DOI:
LIU Yuhao, LIN Ying, WANG Liming, et al. Internal Curing Reaction and Numerical Analysis of Temperature Field of Cycloaliphatic Epoxy Resin Insulators[J]. 2020, 46(6): 1986-1993.DOI:
Internal Curing Reaction and Numerical Analysis of Temperature Field of Cycloaliphatic Epoxy Resin Insulators
Inconsistent internal curing and uneven temperature cause serious internal stress of cycloaliphatic epoxy resin insulators during the curing process. In this paper
differential scanning calorimetry(DSC) was used to analyze the curing characteristics of cycloaliphatic epoxy resin. Ozawa Flynn wall
Friedman Reich Levi and Malek methods were used to calculate the kinetic parameters of curing reaction. Compared with the experimental data
the calculated value of the model was consistent with the measured value
which proved the correctness of the model. Based on the transient heat transfer model
the internal temperature distribution of the cycloaliphatic epoxy resin insulator during curing process was studied. The results show that the curing of cycloaliphatic epoxy resin is exothermic reaction
and the reaction mechanism conforms to autocatalytic model. The curing process can be divided into three stages. The temperature distribution of insulator is obviously different during the curing process
and the lagging effect of heat conduction is more prominent because of the umbrella skirt structure. At the early stage of solidification
the temperature at the root of the umbrella skirt lags behind other parts seriously. At the later stage of solidification
the internal heat of the insulator releases violently
and a phenomenon of "temperature overshoot" appears inside the umbrella skirt. The gradient of temperature distribution at the root chamfer of umbrella skirt is the largest
which easily leads to inconsistent solidification shrinkage and serious internal stress. Reducing the curing temperature and increasing the chamfering at the root of umbrella skirt can effectively improve the uneven distribution of temperature and improve the performance of insulators.