The DC energy dissipating device is subject to instantaneous high-power shocks during operation

and its thermal characteristics are very different from the current steady-state heating power electronic devices. Thus

a new temperature calculation model and system design method are required to be adopted. We propose a thermoelectric equivalent model based on thermal principles

discuss and analyze the influences of boundary conditions

material properties

and diameter on the temperature of a DC energy-consuming device

and propose optimization measures. Moreover

we establish a dynamic system simulation model of DC energy dissipating devices in two modes: natural cooling and water cooling. A model of radiation and natural convection thermal resistance that changes with temperature is used in the natural cooling system

which can effectively improve the accuracy of the model and is verified by experiments. In this paper

a coupling strategy of transient heat source and quasi-steady-state cooling system is used to effectively integrate the DC energy dissipating device with the water-cooled cooling system model

and the system dynamic simulation analysis is performed. Thereby

an optimal power design method of DC energy dissipation device cooling system is proposed. The simulation model and cooling system design method presented in this paper have excellent performance and meet the needs of engineering applications.