Analysis of Metal Vapor Breakdown Process of Vacuum DC Circuit Breaker After Arc Based on PIC-MCC Method
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Analysis of Metal Vapor Breakdown Process of Vacuum DC Circuit Breaker After Arc Based on PIC-MCC Method
Vol. 47, Issue 6, Pages: 2141-2148(2021)
作者机构:
西安交通大学电力设备电气绝缘国家重点实验室
作者简介:
基金信息:
DOI:
CLC:
Published Online:30 June 2021,
Published:2021
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ZHAO Yu, YANG Fei, SUN Hao, et al. Analysis of Metal Vapor Breakdown Process of Vacuum DC Circuit Breaker After Arc Based on PIC-MCC Method[J]. 2021, 47(6): 2141-2148.
DOI:
ZHAO Yu, YANG Fei, SUN Hao, et al. Analysis of Metal Vapor Breakdown Process of Vacuum DC Circuit Breaker After Arc Based on PIC-MCC Method[J]. 2021, 47(6): 2141-2148.DOI:
Analysis of Metal Vapor Breakdown Process of Vacuum DC Circuit Breaker After Arc Based on PIC-MCC Method
the process of dielectric recovery after arc is an important physical process to determine whether the breaking is successful or not
thus it has been widely concerned by researchers. The main purpose of this paper is to study the development process and influencing factors of the breakdown stage of metal vapor in vacuum circuit breaker by particle simulation. Based on the Particle in Cell-Monte Carlo Collisions(PIC-MCC) method
a model of metal vapor breakdown after arc is established
and the development process of metal vapor breakdown is simulated in two-dimensional space and three-dimensional velocity. Then
the influences of some important factors
such as contact surface temperature
metal vapor density
contact distance
and voltage on breakdown are discussed. The simulation results show that
in a certain range
increasing the density of metal vapor
the breakdown occurs more rapidly; the higher the contact temperature is
the more prone to occur the breakdown is; the higher the peak value of transient recovery voltage is
the faster the breakdown occurs. In addition
when the field strength is constant
the breakdown is not easy to occur for a small opening distance
and when the opening distance is large
the breakdown time is hardly affected by the contact distance.